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1

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 23 February 2014)] Advanced Etch Technology for Nanopatterning III - Gate double patterning strategies for 10nm node FinFET devices

Oehrlein, Gottlieb S., Lin, Qinghuang, Zhang, Ying, Hody, Hubert, Paraschiv, Vasile, Hellin, David, Vandeweyer, Tom, Boccardi, Guillaume, Xu, Kaidong

Year:

2014

Language:

english

File:

PDF, 581 KB

english, 2014

2

Mechanistic study of ultralow k-compatible carbon dioxide in situ photoresist ashing processes. II. Interaction with preceding fluorocarbon plasma ultralow k etching processes

Kuo, Ming-Shu, Pal, A. R., Oehrlein, G. S., Hua, Xuefeng

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2010

Language:

english

File:

PDF, 664 KB

english, 2010

3

Mechanistic study of ultralow k-compatible carbon dioxide in situ photoresist ashing processes. I. Process performance and influence on ULK material modification

Kuo, Ming-Shu, Pal, A. R., Oehrlein, G. S., Lazzeri, P., Anderle, M.

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2010

Language:

english

File:

PDF, 644 KB

english, 2010

4

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 23 February 2014)] Advanced Etch Technology for Nanopatterning III - Litho resist rework influences on Cu metal layer patterning with TiN-hard mask

Oehrlein, Gottlieb S., Lin, Qinghuang, Zhang, Ying, Dankelmann, Marcus, Czekalla, Markus, Estel, Heiko, Hahn, Jens, Hong, Bee Kim, Lamm, Mario, Neubert, Eric, Renner, Michael, Scheibel, Rainer, Stegem

Year:

2014

Language:

english

File:

PDF, 2.12 MB

english, 2014

5

Plasma-polymer interactions: A review of progress in understanding polymer resist mask durability during plasma etching for nanoscale fabrication

Oehrlein, Gottlieb S., Phaneuf, Raymond J., Graves, David B.

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2011

Language:

english

File:

PDF, 2.40 MB

english, 2011

6

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 23 February 2014)] Advanced Etch Technology for Nanopatterning III - Directed self-assembly of PS-b-PDMS into 193nm photoresist patterns and transfer into silicon by plasma etching

Oehrlein, Gottlieb S., Lin, Qinghuang, Zhang, Ying, Archambault, Sophie, Girardot, Cécile, Salaün, Mathieu, Delalande, Michael, Böhme, Sophie, Cunge, Gilles, Pargon, Erwine, Joubert, Olivier, Zelsmann

Year:

2014

Language:

english

File:

PDF, 2.59 MB

english, 2014

7

Model polymer etching and surface modification by a time modulated RF plasma jet: role of atomic oxygen and water vapor

Luan, P, Knoll, A J, Wang, H, Kondeti, V S S K, Bruggeman, P J, Oehrlein, G S

Journal:

Journal of Physics D Applied Physics

Year:

2017

Language:

english

File:

PDF, 1.99 MB

english, 2017

8

Photoresist modifications by plasma vacuum ultraviolet radiation: The role of polymer structure and plasma chemistry

F. Weilnboeck, R. L. Bruce, S. Engelmann, G. S. Oehrlein, D. Nest, T. Chung, D. Graves, M. Li, D. Wang, C. Andes, E. A. Hudson

Year:

2010

Language:

english

File:

PDF, 1.39 MB

english, 2010

9

Special Section Guest Editorial: Advanced Plasma-Etch Technology

Lin, Qinghuang, Zhang, Ying, Oehrlein, Gottlieb S.

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2013

Language:

english

File:

PDF, 537 KB

english, 2013

10

Foundations of Low-Temperature Plasma Enhanced Materials Synthesis and Etching

Oehrlein, Gottlieb S, Hamaguchi, Satoshi

Journal:

Plasma Sources Science and Technology

Year:

2018

Language:

english

File:

PDF, 856 KB

english, 2018

11

PEER-REVIEWED JOURNAL EDITORS’ VIEWS ON REAL-WORLD EVIDENCE

Oehrlein, Elisabeth M., Graff, Jennifer S., Perfetto, Eleanor M., Mullins, C. Daniel, Dubois, Robert W., Anyanwu, Chinenye, Onukwugha, Eberechukwu

Journal:

International Journal of Technology Assessment in Health Care

Year:

2018

Language:

english

File:

PDF, 287 KB

english, 2018

12

Fluorocarbon high-density plasmas. II. Silicon dioxide and silicon etching using CF4 and CHF3

Oehrlein, G. S.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1994

Language:

english

File:

PDF, 1.51 MB

english, 1994

13

On the absence of post-plasma etch surface and line edge roughness in vinylpyridine resists

Bruce, R. L., Weilnboeck, F., Lin, T., Phaneuf, R. J., Oehrlein, G. S., Long, B. K., Willson, C. G., Alizadeh, A.

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2011

Language:

english

File:

PDF, 937 KB

english, 2011

14

Differences in erosion mechanism and selectivity between Ti and TiN in fluorocarbon plasmas for dielectric etch

F. Weilnboeck, E. Bartis, S. Shachar, G. S. Oehrlein, D. Farber, T. Lii, C. Lenox

Year:

2012

Language:

english

File:

PDF, 1.50 MB

english, 2012

15

Study of Ti etching and selectivity mechanism in fluorocarbon plasmas for dielectric etch

F. Weilnboeck, E. Bartis, S. Shachar, G. S. Oehrlein, D. Farber, T. Lii, C. Lenox

Year:

2012

Language:

english

File:

PDF, 1.28 MB

english, 2012

16

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 23 February 2014)] Advanced Etch Technology for Nanopatterning III - Plasma etching and integration challenges using alternative patterning techniques for 11nm node and beyond

Oehrlein, Gottlieb S., Lin, Qinghuang, Zhang, Ying, Barnola, S., Pimenta Barros, P., Arvet, C., Vizioz, C., Posseme, N., Gharbi, A., Argoud, M., Tiron, R., Pradelles, J., Desvoivres, L., Barraud, S.

Year:

2014

Language:

english

File:

PDF, 2.11 MB

english, 2014

17

High-Density Plasma Etching of Low Dielectric Constant Materials

Standaert, T. E. F. M., Matsuo, P. J., Allen, S. D., Oehrlein, G. S., Dalton, T. J., Lu, T.-M., Gutmann, R.

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 2.29 MB

english, 1998

18

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 24 February 2013)] Advanced Etch Technology for Nanopatterning II - Yield enhancement of 3D flash devices through broadband brightfield inspection of the channel hole process module

Lee, Jung-Youl, Seo, Il-Seok, Ma, Seong-Min, Kim, Hyeon-Soo, Kim, Jin-Woong, Kim, DoOh, Cross, Andrew, Zhang, Ying, Oehrlein, Gottlieb S., Lin, Qinghuang

Year:

2013

Language:

english

File:

PDF, 642 KB

english, 2013

19

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 24 February 2013)] Advanced Etch Technology for Nanopatterning II - Tall FIN formation for FINFET devices of 20nm and beyond using multi-cycles of passivation and etch processes

Choi, Dae-han, Yang, Dae Geun, Khanna, Puneet, Maeng, Chang, Hu, Owen, Shen, Hongliang, Wei, Andy, Kim, Sung, Zhang, Ying, Oehrlein, Gottlieb S., Lin, Qinghuang

Year:

2013

Language:

english

File:

PDF, 1.49 MB

english, 2013

20

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 23 February 2014)] Advanced Etch Technology for Nanopatterning III - 28nm FDSOI high-K metal gate CD variability investigation

Oehrlein, Gottlieb S., Lin, Qinghuang, Zhang, Ying, Desvoivres, L., Gouraud, P., Le Gratiet, B., Bouyssou, R., Ranica, R., Gallon, C., Thomas, I.

Year:

2014

Language:

english

File:

PDF, 623 KB

english, 2014

21

Formation of nanometer-thick delaminated amorphous carbon layer by two-step plasma processing of methacrylate-based polymer

Metzler, Dominik, Weilnboeck, Florian, Hernández, Sandra C., Walton, Scott G., Bruce, Robert L., Engelmann, Sebastian, Salamanca-Riba, Lourdes, Oehrlein, Gottlieb S.

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2015

Language:

english

File:

PDF, 2.06 MB

english, 2015

22

Effect of water vapor on plasma processing at atmospheric pressure: Polymer etching and surface modification by an Ar/H 2 O plasma jet

Luan, Pingshan, Kondeti, V. S. Santosh K., Knoll, Andrew J., Bruggeman, Peter J., Oehrlein, Gottlieb S.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2019

Language:

english

File:

PDF, 1.65 MB

english, 2019

23

Analyzing the Supply and Detecting Spatial Patterns of Urban Green Spaces via Optimization

Oehrlein, Johannes, Niedermann, Benjamin, Haunert, Jan-Henrik

Journal:

PFG – Journal of Photogrammetry, Remote Sensing and Geoinformation Science

Year:

2019

File:

PDF, 20.82 MB

2019

24

Selective atomic layer etching of HfO 2 over silicon by precursor and substrate-dependent selective deposition

Lin, Kang-Yi, Li, Chen, Engelmann, Sebastian, Bruce, Robert L., Joseph, Eric A., Metzler, Dominik, Oehrlein, Gottlieb S.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2020

Language:

english

File:

PDF, 6.22 MB

english, 2020

25

Significance of plasma-photoresist interactions for atomic layer etching processes with extreme ultraviolet photoresist

Pranda, Adam, Lin, Kang-Yi, Engelmann, Sebastian, Bruce, Robert L., Joseph, Eric A., Metzler, Dominik, Oehrlein, Gottlieb S.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2020

File:

PDF, 6.27 MB

2020

26

Poly(2-vinylnaphthalene)-block-poly(acrylic acid) Block Copolymer: Self-Assembled Pattern Formation, Alignment, and Transfer into Silicon via Plasma Etching

Xin Zhang, Christopher J. Metting, Robert M. Briber, Florian Weilnboeck, Sang Hak Shin, Benjamin G. Jones, Gottlieb S. Oehrlein

Journal:

Macromolecular Chemistry and Physics

Year:

2011

Language:

english

File:

PDF, 639 KB

english, 2011

27

Plasma-deposited fluorocarbon films on silicon studied by ellipsometry

Gottlieb S. Oehrlein, Ivar Reimanis, Young H. Lee

Journal:

Thin Solid Films

Year:

1986

Language:

english

File:

PDF, 548 KB

english, 1986

28

Capacitance-voltage properties of thin Ta2O5 films on silicon

Gottlieb S. Oehrlein

Journal:

Thin Solid Films

Year:

1988

Language:

english

File:

PDF, 1.22 MB

english, 1988

29

Dry etching damage of silicon: A review

Gottlieb S. Oehrlein

Journal:

Materials Science and Engineering: B

Year:

1989

Language:

english

File:

PDF, 906 KB

english, 1989

30

Interactions of photoresist stripping plasmas with nanoporous organo-silicate ultra low dielectric constant dielectrics

P. Lazzeri, G.S. Oehrlein, G.J. Stueber, R. McGowan, E. Busch, S. Pederzoli, C. Jeynes, M. Bersani, M. Anderle

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 591 KB

english, 2008

31

Sidewall surface chemistry in directional etching processes

Gottlieb S. Oehrlein, Yukinori Kurogi

Journal:

Materials Science and Engineering: R: Reports

Year:

1998

Language:

english

File:

PDF, 1.05 MB

english, 1998

32

Dependence of Polymer Surface Roughening Rate on Deposited Energy Density During Plasma Processing

Sebastian Engelmann, Robert L. Bruce, Florian Weilnboeck, Gottlieb S. Oehrlein, Dustin Nest, David B. Graves, Cecily Andes, Eric A. Hudson

Journal:

Plasma Processes and Polymers

Year:

2009

Language:

english

File:

PDF, 272 KB

english, 2009

33

Some properties of crystallized tantalum pentoxide thin films on silicon

Oehrlein, G. S., d’Heurle, F. M., Reisman, A.

Journal:

Journal of Applied Physics

Year:

1984

Language:

english

File:

PDF, 1.20 MB

english, 1984

34

Effect of surface derived hydrocarbon impurities on Ar plasma properties

Fox-Lyon, Nick, Oehrlein, Gottlieb S., Godyak, Valery

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2014

Language:

english

File:

PDF, 571 KB

english, 2014

35

Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma

Metzler, Dominik, Bruce, Robert L., Engelmann, Sebastian, Joseph, Eric A., Oehrlein, Gottlieb S.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2014

Language:

english

File:

PDF, 1.02 MB

english, 2014

36

Damage of ultralow k materials during photoresist mask stripping process

Hua, Xuefeng, Kuo, Ming-shu, Oehrlein, G. S., Lazzeri, P., Iacob, E., Anderle, M., Inoki, C. K., Kuan, T. S., Jiang, P., Wu, Wen-li

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2006

Language:

english

File:

PDF, 633 KB

english, 2006

37

Optical tweezers directed one-bead one-sequence synthesis of oligonucleotides

Wang, Tao, Oehrlein, Stefan, Somoza, Mark M., Sanchez Perez, Jose R., Kershner, Ryan, Cerrina, Franco

Journal:

Year:

2011

Language:

english

File:

PDF, 640 KB

english, 2011

38

Plasma-based dry etching techniques in the silicon integrated circuit technology

Oehrlein, G. S., Rembetski, J. F.

Journal:

IBM Journal of Research and Development

Year:

1992

Language:

english

File:

PDF, 1.45 MB

english, 1992

39

Effects of ion bombardment in plasma etching on the fluorinated silicon surface layer: Real-time and postplasma surface studies

Oehrlein, Gottlieb S.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1993

Language:

english

File:

PDF, 1.35 MB

english, 1993

40

Gas-phase studies in inductively coupled fluorocarbon plasmas

Schaepkens, M., Martini, I., Sanjuan, E. A., Li, X., Oehrlein, G. S., Perry, W. L., Anderson, H. M.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2001

Language:

english

File:

PDF, 647 KB

english, 2001

41

Patterning of fluorine-, hydrogen-, and carbon-containing SiO[sub 2]-like low dielectric constant materials in high-density fluorocarbon plasmas: Comparison with SiO[sub 2]

Standaert, T. E. F. M., Matsuo, P. J., Allen, S. D., Oehrlein, G. S., Dalton, T. J.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1999

Language:

english

File:

PDF, 512 KB

english, 1999

42

Structure of the boron-hydrogen complex in crystalline silicon

Marwick, A. D., Oehrlein, G. S., Johnson, N. M.

Journal:

Physical Review B

Year:

1987

Language:

english

File:

PDF, 177 KB

english, 1987

43

Characterization and mechanism of He plasma pretreatment of nanoscale polymer masks for improved pattern transfer fidelity

F. Weilnboeck, D. Metzler, N. Kumar, G. S. Oehrlein, R. L. Bruce, S. Engelmann, N. Fuller

Year:

2011

Language:

english

File:

PDF, 1.45 MB

english, 2011

44

Tungsten etching mechanisms in CF4/O2 reactive ion etching plasmas

T. D. Bestwick, G. S. Oehrlein

Year:

1989

Language:

english

File:

PDF, 832 KB

english, 1989

45

Surface and near-surface modifications of ultralow dielectric constant materials exposed to plasmas under sidewall-like conditions

M. Kuo, G. S. Oehrlein

Year:

2010

Language:

english

File:

PDF, 748 KB

english, 2010

46

Role of fluorocarbon film formation in the etching of silicon, silicon dioxide, silicon nitride, and amorphous hydrogenated silicon carbide

Standaert, T. E. F. M., Hedlund, C., Joseph, E. A., Oehrlein, G. S., Dalton, T. J.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2004

Language:

english

File:

PDF, 508 KB

english, 2004

47

Highly selective etching of silicon nitride over silicon and silicon dioxide

Kastenmeier, B. E. E., Matsuo, P. J., Oehrlein, G. S.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1999

Language:

english

File:

PDF, 418 KB

english, 1999

48

A Review of SiO[sub 2] Etching Studies in Inductively Coupled Fluorocarbon Plasmas

Schaepkens, Marc, Oehrlein, Gottlieb S.

Journal:

Journal of The Electrochemical Society

Year:

2001

Language:

english

File:

PDF, 990 KB

english, 2001

49

Photoluminescence of Defects Produced by Reactive Ion Etching of Silicon

Northrop, G.A., Oehrlein, G.S.

Journal:

Materials Science Forum

Year:

1986

File:

PDF, 330 KB

1986

50

Studies of fluorocarbon film deposition and its correlation with etched trench sidewall angle by employing a gap structure using C[sub 4]F[sub 8]∕Ar and CF[sub 4]∕H[sub 2] based capacitively coupled plasmas

L. Ling, X. Hua, L. Zheng, G. S. Oehrlein, E. A. Hudson, P. Jiang

Year:

2008

Language:

english

File:

PDF, 1.04 MB

english, 2008

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